ANSYS 17.1 delivers optimized system performance for early design process
Engineers can optimize system performance for next-generation products quicker and easier with the newly released ANSYS® 17.1. Building upon the 10x improvements in performance and productivity delivered in ANSYS 17.0, engineers can tap into new system-wide simulation capabilities to optimize system performance early on in the design process thanks to enhancements made across ANSYS’ core solutions. Using simulation early in the product design cycle enables organizations to reduce product time-to-market by 9x, minimize cost by 4x and maximize quality by correcting any design flaws early in the design phase. 17.1 takes another big step forward towards ANSYS vision of full virtual prototype.
Model, Simulate and Analyze Virtual System Prototypes with System Simulation
As products become more complex, the ability to simulate entire systems - including mechanical, electronics, and software - provides a significant advantage. This enables engineers to optimize for the individual components as well as for the combined behavior in the full system. With ANSYS 17.1 engineers can quickly create physics-based component models and embedded software designs for complete virtual prototypes of multi-domain systems. ANSYS 17.1 provides detailed physics models in combination with embedded software and complex behavioral models of components to perform complete product evaluation early in the design process – enabling organizations to accurately predict how a product will perform in real world conditions. By identifying potential issues early in the development process before design choices are solidified, costly late-state changes can be avoided.
ANSYS AIM Redefines Ease of Use and Intuitive Simulation with New and Extended Physics
More engineers than ever before can now reap the benefits of the markets best and most trusted simulation technology using the latest version of ANSYS® AIM®. Built for design engineers, AIM is an integrated, easy-to-use simulation environment based on proven ANSYS solver technology. In addition to newly extended structural and fluid flow simulation capabilities, ANSYS AIM now provides product designers with magnetostatics and coupled magnetic-thermal-structural analysis to rapidly design innovative electromechanical products. New polymer extrusion simulation enables designers to identify manufacturing issues early on and reduce tooling lead time. ANSYS 17.1 boosts the customization and automation capabilities of AIM by introducing multi-step custom templates that allow accurate and repeatable simulation methods to be codified and deployed during early stages of product design – reducing product development time and cost.
Enhancements Across All Engineering Disciplines
In addition to the advancements in system simulation and multiphysics, engineers can take advantage of several new enhancements ANSYS 17.1 delivers across the entire portfolio and ANSYS® Workbench™ platform. ANSYS’ electronic technology for antenna and wireless modeling empowers engineers with extended models and design flow automation – enabling organizations to meet the growing demands of the Internet of Things and wireless device markets.
Designing and routing cable structures to meet electromagnetic compatibility standards and packaging requirements in large automotive or aeronautical systems has become increasingly complex and make traditional design rules obsolete. The ANSYS 17.1 electronics suite is equipped with new innovations to efficiently analyze signal integrity through complex cable paths.
In the fluids suite, engineers can prepare large and complex models – from aerospace to under-hood simulations easier thanks to the new fully integrated toolset to navigate, display and manage large computer-aided design datasets. Also new to the fluids suite is cyclic and polar plots that display the results of a transient row analysis, making it easier for users to understand and communicate transient periodic behaviour, commonly found in turbomachinery simulations due to blade row interaction.
Building upon the solutions for simulating large fabricated structures, the ANSYS mechanical suite offers new beam-to-solid and shell-to-solid sub-modeling. Now structural engineers can easily convert lower dimensional models used in early design stages to high fidelity 3-D models for a detailed investigation of critical areas. In addition to the performance enhancements across its product lines, ANSYS 17.1 delivers performance improvements for motion analysis. Systems with large number of contacting and sliding parts, such as chain drives and gear assemblies, solve 10 to 20 times faster using new innovations in time stepping schemes and the implementation of mesh based contact detection.
ANSYS semiconductor process technologies have kept in-step with new advancements to enable customers to innovate mobile, computing, networking and IoT applications. Overall simulation runtime performance has been improved by up to 30 percent with a 2x reduction in memory footprint by harnessing distributed machine processing technology for transistor-level analog and mixed signal designs including memory. ANSYS also now supports thermally aware electromigration analysis, enabling users to design with FinFET transistor technology. To further improve low-power chip design, ANSYS 17.1 delivers faster power analysis, better accuracy and greater reduction of power, enabling customers to deliver smaller, higher-power density devices to market faster.