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ANSYS named TSMC

By Niraj M Wanikar, Chief Editor, CNCTimes.com, 2015-10-13 11:24:05

 

TSMC has honored ANSYS with its 2015 Open Innovation Platform® (OIP) Partner of the Year award for joint development of the 10nm FinFET design infrastructure to address the power integrity and reliability requirements for chip applications.

The award is given to TSMC OIP partners that have made significant contributions toward the development of design infrastructure for their latest process technologies. ANSYS was recognized for advanced power noise, electromigration (EM) and thermal reliability solutions that helped enable TSMC's 10 nanometer FinFET technology deployment. This technology enables users to innovate the next generation of system on a chip (SoC) designs for use in emerging mobile, computing and networking applications.

"TSMC is an industry visionary – and ANSYS is proud and humbled to partner with this remarkable organization," said Mr John Lee, general manager, ANSYS. "Together we continue to help the semiconductor industry push the boundaries of innovation and to have a positive impact on our lives."

"ANSYS has been a long-term partner to TSMC, collaborating with us to jointly bring deep technical experience to address the new power, EM and thermal reliability challenges associated with next-generation products," said Mr Suk Lee, TSMC senior director, design infrastructure marketing division. "This award is well deserved, and we look forward to extending our collaboration so our customers can continue to produce the most cutting-edge products on the planet."

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