Intel Custom Foundry certifies ANSYS for next-generation 10NM Tri-Gate Process
Intel Custom Foundry customers are powering cutting-edge products thanks to Intel Custom Foundry's certification of ANSYS (NASDAQ: ANSS) solutions for electromigration, power and electrostatic discharge reference flows for its 10-nanometer (nm), third-generation tri-gate process technology. The supported tools from ANSYS and Intel Custom Foundry’s collaboration enable mutual customers to minimize design costs and risks and bring innovative and reliable products to market quickly.
Advanced electronic products demand higher performance with less power and excellent reliability. To achieve this today, multiple subsystems of an electronic product are combined into one or more integrated circuits known as system on a chip (SoC). Simulation tools are critical to designing these subsystems to deliver the required combination of power, performance, reliability and cost to minimize risk and maximize savings.
ANSYS solutions deliver needed accuracy while reducing turnaround time to meet the increased computational requirements caused by the growing design complexity of modern products. Advanced technology support in ANSYS® RedHawk™, ANSYS® Totem™ and ANSYS® PathFinder™, including electromigration rule compliance and color-aware resistance extraction, help deliver greater reliability and manufacturability.
The certification from Intel Custom Foundry for its advanced 10nm technology validates the capability to simulate designs while maintaining sign-off accuracy. It enables designers to meet increasingly stringent power and reliability requirements for their intellectual properties, analog and custom integrated circuit designs. The mutual customers of Intel Custom Foundry and ANSYS can design cutting-edge applications such as mobile products and networking infrastructure products based on this 10nm certification.
"The certification of ANSYS tools gives our mutual customers a competitive advantage when implementing robust, high-performance intellectual properties and SoCs on our 10nm design platform," said Venkat Immaneni, senior director, Foundry Design Kit Enablement for Intel Custom Foundry. "It also allows our mutual customers to take advantage of the superior power, performance and area (PPA) from Intel's third-generation 10nm tri-gate process technology to achieve high-quality designs."
"Our collaboration with Intel Custom Foundry on the 10nm design platform and its certification of our electromigration, power and electrostatic discharge solutions underscore the quality of results and added benefits of ANSYS simulation tools," said John Lee, general manager at ANSYS. "This empowers Intel Custom Foundry customers to develop and validate robust and reliable SoCs quickly and accurately."