Siemens places spotlight on interplay between automation and digitisation
Siemens will be exhibiting at the SPS IPC Drives under the banner "Making Things Right" with a comprehensive overview of its portfolio. Visitors can look forward to a wide range of product innovations across every field from industrial software, automation and drive technology to services.
The focal theme of the Siemens presentation will be the interplay between automation and digitisation along the entire industrial value chain, demonstrating how innovative software and hardware can be used to merge virtual and real production processes. The exhibited solutions and products cover every step of the product development and production process – starting with design and planning through engineering and execution to service. Key levers for productivity in this context are integrated technology platforms such as Totally Integrated Automation (TIA), Integrated Drive Systems (IDS) and Totally Integrated Power (TIP).
"Our aim is to enhance the competitive standing of our customers and to make their production faster, more flexible and smarter,” said Mr Heinz Eisenbeiss, Booth Manager for Siemens at the SPS IPC Drives, speaking at the pre-fair press conference. "The SPS IPC Drives has become established as the lead fair for electrical automation and as a landmark event in the industry calendar. As a leading supplier, Siemens is a central port of call for visitors to the fair. The new location in Hall 11 offers us the perfect backdrop to address the high level of interest shown by the trade public in our comprehensive offering of industrial software, automation and drive technology as well as services."
Visitors to the stand will have the chance to talk to experts and benefit from their advice. On all three days of the fair, product presentations and tutorials will be held on a stage at the booth. The centre piece of the booth will feature an exhibit illustrating how Siemens supports companies in the creation of a cohesive workflow along the entire industrial value chain. This is illustrated using the example of various customer reference projects and also one of Siemens's own products: the exhibit allows visitors to trace the progress of a Sirius component from the CAD/CAE model through to an actual production step at a real assembly machine.
The product innovations from Siemens on show at this year's SPS IPC Drives include a whole selection of new Simatic controllers with the focus on failsafe CPUs. In addition, for the very first time the company will be featuring an S7-1500 software controller for PC-based automation and a modular open controller with PC-based software controller, visualisation and central I/Os in a single device. In the field of industrial identification, the company is expanding its Simatic RF600 RFID system with the launch of a new generation of exceptionally reliable UHF readers for production and logistics applications.
Furthermore, there has been an addition to the Sirius modular system with the innovation of a new S2 size featuring a mounting width of 55mm. The new switching, protection and monitoring devices are designed for currents of up to 80A and outputs of up to 37kW, and take up only minimal space in the control cabinet.
Siemens will also be presenting a new addition to its Plant Data Services portfolio by the name of "Control Performance Analytics", which is aimed at optimising plants operating in the process industries through analysis of process and status data from control loops.
In the field of drive technology, Siemens will be presenting new Simotics motors conforming to efficiency class IE4. Because there are no shaft height jumps from IE1 to IE4, the motors can be simply exchanged by the user. The new motors are optionally available in a gray cast iron or aluminum housing. Siemens is also extending its range of converters by launching a second generation of its Sinamics G120 modular converter series. The new generation of these rugged devices is available in three voltage variants 200V, 400V and 690V, and thanks to its new power module technology offers greater power density coupled with a space-saving design.